Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars

A method of making a semiconductor device, comprising:

• providing a substrate including a first contact pad and a second contact pad, wherein the first and second contact pads extend from a perimeter of the substrate toward an opening in a central region of the substrate and are connected at the perimeter of the substrate;
• disposing a first semiconductor component over the first contact pad and the central region of the substrate;
• disposing a second semiconductor component over the first semiconductor component and the substrate;
• and
• disposing a conductive pillar between the second semiconductor component and the second contact pad of the substrate outside a footprint of the first semiconductor component.

A semiconductor device, comprising:

• a substrate including a first contact pad and a second contact pad, wherein the first and second contact pads extend from a perimeter of the substrate toward an opening in a central region of the substrate and are connected at the perimeter of the substrate;
• a first semiconductor component disposed over the first contact pad and the central region of the substrate;
• a second semiconductor component disposed over the first semiconductor component and the substrate;
• and
• a conductive pillar disposed between the second semiconductor component and the second contact pad of the substrate outside a footprint of the first semiconductor component.