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US 9,177,899 B2Granted
Semiconductor package and method for fabricating base for semiconductor package
AssigneeMediatek Inc.
InventorsTzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang
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Abstract
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
Claims8
A method for fabricating a base for a semiconductor package, comprising:
- providing a carrier with conductive seed layers on a top surface and a bottom surface of the carrier;
- forming first conductive traces respectively on the conductive seed layers;
- performing a laminating process to respectively dispose a first base material layer and a second base material layer on the conductive seed layers, covering the first conductive traces;
- forming second conductive traces respectively on first surfaces of the first base material layer and the second base material layer, wherein the first surfaces of the first base material layer and the second base material layer are respectively away from the top surface and the bottom surface of the carrier;
- and
- separating the first base material layer containing the first and second conductive traces thereon and the second base material layer containing the first and second conductive traces thereon from the carrier to form a first base and a second base.
3 more elements
Dependencies are inferred from the claim text.