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US 9,177,898 B2Granted
Integrated circuit package system with locking terminal
AssigneeSTATS ChipPAC, Ltd.
InventorsIl Kwon Shim, Seng Guan Chow
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes: forming a first locking terminal having a first terminal recess with a top portion of the first terminal recess narrower than a bottom portion of the first terminal recess; connecting an integrated circuit and the first locking terminal; and forming a package encapsulation over the integrated circuit and in the first locking terminal.
Claims20
A method for manufacturing an integrated circuit package system comprising:
- forming a first locking terminal having a first terminal base, a first terminal wall around the first terminal base, and a first terminal rim extending outward completely around the first terminal wall, with the first terminal wall extending upward from the first terminal base, the first locking terminal having a first terminal recess defined by the first terminal base and the first terminal wall slanted inward wherein a top opening of the first terminal recess is narrower than a bottom of the first terminal recess;
- forming a second locking terminal having a second terminal base, a second terminal wall, and a second terminal rim, with the bottom side of the second terminal base co-planar with the bottom side of the first terminal base;
- connecting an integrated circuit and the first locking terminal;
- and
- forming a package encapsulation over the integrated circuit and the first locking terminal, the package encapsulation having a package perimeter completely surrounding the first locking terminal, the bottom side of the first terminal base exposed from the package encapsulation, and the first terminal rim exposed from the package encapsulation.
2 more elements
A method for manufacturing an integrated circuit package system comprising:
- forming a first locking terminal having a first terminal base, a first terminal wall around the first terminal base, and a first terminal rim extending outward completely around the first terminal wall, with the first terminal wall extending upward from the first terminal base, the first locking terminal having a first terminal recess defined by the first terminal base and the first terminal wall slanted inward wherein a top opening of the first terminal recess is narrower than a bottom of the first terminal recess;
- forming a second locking terminal having a second terminal base, a second terminal wall, and a second terminal rim, with the bottom side of the second terminal base co-planar with the bottom side of the first terminal base;
- forming a locking paddle having a paddle recess with a top of the paddle recess narrower than a bottom of the paddle recess;
- mounting an integrated circuit over the locking paddle and in the paddle recess;
- connecting the integrated circuit and the first locking terminal;
- and
- forming a package encapsulation over the integrated circuit and in the first locking terminal and the locking paddle, the package encapsulation having a package perimeter completely surrounding the first locking terminal and the second locking terminal, the bottom side of the first terminal base exposed from the package encapsulation, and the first terminal rim exposed from the package encapsulation.
4 more elements
An integrated circuit package system comprising:
- a first locking terminal having a first terminal base, a first terminal wall around the first terminal base, and a first terminal rim extending outward completely around the first terminal wall, with the first terminal wall extending upward from the first terminal base, the first locking terminal having a first terminal recess defined by the first terminal base and the first terminal wall slanted inward wherein a top opening of the first terminal recess is narrower than a bottom of the first terminal recess;
- a second locking terminal having a second terminal base, a second terminal wall, and a second terminal rim, with the bottom side of the second terminal base co-planar with the bottom side of the first terminal base;
- an integrated circuit connected with the first locking terminal;
- and
- a package encapsulation over the integrated circuit, the first locking terminal, and the second locking terminal, with the package encapsulation having a package perimeter completely surrounding the first locking terminal, the bottom side of the first terminal base exposed from the package encapsulation, and the first terminal rim exposed from the package encapsulation.
2 more elements
Dependencies are inferred from the claim text.