Apparatus and method for increasing bandwidths of stacked dies
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShyh-An Chi, Mark Shane Peng
Life of this patent
Estimating the term…
Abstract
A package structure includes a plurality of die carriers identical to each other. The respective features in each of the plurality of die carriers vertically overlap corresponding features in other ones of the plurality of die carriers. Each of the plurality of die carriers includes a plurality of through-substrate vias (TSVs) including a plurality of data buses. The plurality of die carriers is stacked and electrically connected to each other through the plurality of TSVs. The package structure further includes a plurality of device dies. Each of the plurality of device dies is bonded to one of the plurality of die carriers. Each of the plurality of data buses is configured to dedicate to data transmission of one of the plurality of device dies.
Claims20
A package structure comprising:
- a plurality of data buses;
- a first die carrier comprising:
- a portion of each of the plurality of data buses, wherein each of the plurality of data buses penetrates through the first die carrier;
- a first device die and a second device die bonded to opposite sides of the first die carrier, wherein the plurality of data buses comprises a first data bus and a second data bus configured to dedicate to data transmission of the first device die and the second device die, respectively;
- a second die carrier over and stacked on the first die carrier, wherein the second die carrier comprises an additional portion of each of the plurality of data buses, and wherein each of the plurality of data buses penetrates through the second die carrier;
- and
- a third device die and a fourth device die bonded to opposite sides of the second die carrier, wherein the plurality of data buses comprises a third data bus and a fourth data bus configured to dedicate to data transmission of the third device die and the fourth device die, respectively.
A package structure comprising:
- a plurality of data buses;
- a plurality of device dies identical to each other;
- and
- a plurality of die carriers stacked and electrically connected to each other to form a stack, wherein each of the plurality of device dies is bonded to one of the plurality of die carriers, wherein each of the plurality of data buses extends from a top one to a bottom one of the plurality of die carriers and penetrates through the top one and the bottom one of the plurality of die carriers, and is configured to dedicate to data transmission of one of the plurality of device dies, and wherein the plurality of die carriers is electrically coupled with each other.
A package structure comprising:
- a plurality of device dies;
- and
- a plurality of die carriers stacked together, wherein a first one and a second one of the plurality of device dies are bonded to two of the plurality of die carriers, and wherein each of the plurality of die carriers comprises:
- a portion of each of a plurality of data buses penetrating through the each of the plurality of die carriers, wherein each of the plurality of data buses is configured to dedicate to data transmission of one of the plurality of device dies;
- and
- die carrier ID lines connected to die carrier ID lines in an overlying or an underlying one of the plurality of die carriers.
Dependencies are inferred from the claim text.