Implementing microscale thermoacoustic heat and power control for processors and 3D chipstacks
AssigneeInternational Business Machines Corporation
InventorsBret P. Elison, Phillip V. Mann, Arvind K. Sinha
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Abstract
A method and apparatus are provided for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks. A thermoacoustic heat engine is integrated with a 3D chip-stack and high power processors. The thermoacoustic heat engine is used in cooperation with a heat sink associated with the 3D chip-stack. Predefined connecting layers connect the 3D chip-stack to a cooling end of a thermoacoustic stack of the thermoacoustic heat engine, allowing the cooled end of the resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink.
Claims16
An apparatus for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks comprising:
- a three dimensional (3D) chip stack;
- a heat sink associated with said 3D chip-stack;
- a thermoacoustic heat engine integrated with said 3D chip-stack;
- said thermoacoustic heat engine being used in cooperation with said heat sink associated with the 3D chip-stack;
- said thermoacoustic heat engine including an acoustic resonator connected to a thermoacoustic stack;
- and
- a plurality of predefined connecting layers spliced into said 3D chip-stack and directly connecting said 3D chip-stack to a first cool end of said thermoacoustic stack of said thermoacoustic heat engine, allowing said first cool end of said resonator to maintain temperature within said 3D chip-stack and to increase the efficiency of the heat sink.
A method for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks comprising:
- integrating a thermoacoustic heat engine with a 3D chip-stack;
- providing a heat sink associated with the 3D chip-stack used in cooperation with said thermoacoustic heat engine;
- providing said thermoacoustic heat engine including an acoustic resonator connected to a thermoacoustic stack;
- and
- providing a plurality of predefined connecting layers spliced into said 3D chip-stack and directly connecting the 3D chip-stack to a first cool end of said thermoacoustic stack of said thermoacoustic heat engine, allowing said first cool end of said resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink.
Dependencies are inferred from the claim text.