Electrically isolated power semiconductor package with optimized layout

A method comprising:

• attaching a packaged power semiconductor device to a heat sink, wherein the packaged power semiconductor device comprises a plurality of electrically conductive leads, a semiconductor device, a substrate and an amount of encapsulant, wherein the amount of encapsulant is disposed over the semiconductor die, the substrate and a portion of each of the plurality of electrically conductive leads such that the amount of encapsulant does not cover a major surface of the substrate thereby leaving a portion of the substrate exposed on a lower surface of the packaged power semiconductor device, wherein the amount of encapsulant includes an extended region of encapsulant that extends away from the plurality of electrically conductive leads, wherein the extended region has an upper surface, a lower surface, an end surface opposite the electrically conductive leads, and a pair of side surfaces, wherein a protrusion of encapsulant extends downward beyond the lower surface of the extended region at a location on the lower surface adjacent to the end surface, and wherein the amount of encapsulant forms a hole that extends from the upper surface of the extended region to the lower surface of the extended region and does not extend through any part of the substrate.

A method comprising:

• forming an amount of encapsulant over a semiconductor die, a substrate and a portion of each of a plurality of electrically conductive leads such that the amount of encapsulant does not cover a major surface of the substrate thereby leaving a portion of the substrate exposed on a lower surface of a packaged power semiconductor device, wherein the amount of encapsulant that is formed includes an extended region of encapsulant that extends away from the plurality of electrically conductive leads, wherein the extended region has an upper surface, a lower surface, an end surface opposite the electrically conductive leads, and a pair of side surfaces, and wherein a protrusion of encapsulant protrudes past the lower surface of the extended region at a location on the lower surface adjacent to the end surface.