Back to results
US 9,177,886 B2Granted
Semiconductor package including chip support and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJi-Han Ko, Woo-Dong Lee, Tae-Sung Park
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a circuit board comprising a first surface and a second surface opposite the first surface. A first semiconductor chip is stacked on the first surface and a second semiconductor chip stacked on the first semiconductor chip. A region of the second chip protrudes beyond a side of the first semiconductor chip. A support underpins the protruding region of the second chip. The support may be, for example, dry film solder resist dam.
Claims15
A semiconductor package comprising:
- a circuit board comprising a first surface and a second surface opposite the first surface;
- a first semiconductor chip stacked on the first surface;
- a second semiconductor chip cross-stacked on the first semiconductor chip, the cross-stacking leaving terminal pads on the first semiconductor chip uncovered by the second semiconductor chip and a first protruding region of the second semiconductor chip protruding beyond a side of the first semiconductor chip;
- a dry film solder resist dam between the first protruding region and the first surface to underpin the first protruding region;
- and
- a liquid solder resist film covering at least part of the first surface of the circuit board, wherein the dry film solder resist dam is directly disposed on the liquid solder resist film.
3 more elements
A semiconductor system, comprising:
- a semiconductor memory;
- and
- a controller, wherein the semiconductor memory or controller is packaged in a cross-stacked package that includes:
- a circuit board comprising a first surface and a second surface opposite the first surface;
- a first semiconductor chip stacked on the first surface;
- a second semiconductor chip cross-stacked on the first semiconductor chip, the cross-stacking leaving terminal pads on the first chip uncovered by the second chip and a first region of the second chip protruding beyond a side of the first chip;
- and
- a dry film solder resist dam between the first protruding region and the first surface to underpin the first protruding region;
- and
- a liquid solder resist film covering at least part of the first surface of the circuit board, wherein the dry film solder resist dam is directly disposed on the liquid solder resist film.
7 more elements
Dependencies are inferred from the claim text.