Chip mounting
AssigneeCambridge Silicon Radio Limited
InventorSimon Jonathan Stacey
Life of this patent
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Abstract
A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, said buffer layers having a Young's Modulus of 2.5GPa or less.
Claims17
A chip including a substrate defining one or more electronic devices and one or more solder elements located within the area of the chip and electrically connected to said one or more electronic devices, wherein the chip is provided with two impact resisting buffer layers between the substrate and the solder elements and a patterned conductive layer sandwiched between the said buffer layers for electrically connecting said one or more solder elements to said one or more electronic devices, said buffer layers each having a Young's Modulus in the range of 1.6GPa to 2.4GPa, wherein the buffer layer between the substrate and the patterned conductive layer has a thickness in the range from 7 to 8 microns.
Dependencies are inferred from the claim text.