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US 9,177,882 B2Granted
Semiconductor integrated circuit device, electronic apparatus, and display apparatus
AssigneeRohm Co., Ltd.
InventorsHiroyuki Inokuchi, Ken Hashimoto, Tomoya Sakai
Life of this patent
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Abstract
A semiconductor integrated circuit device includes a COF substrate; a semiconductor integrated circuit mounted on the COF substrate and having a first voltage circuit portion operating at a first voltage range and a second voltage circuit portion operating at a second voltage range higher than the first voltage range, the circuit portions being formed on a single chip; and a resin layer for sealing the COF substrate and the semiconductor integrated circuit.
Claims10
A semiconductor integrated circuit device comprising:
- a COF (Chip On Film) substrate;
- a semiconductor integrated circuit mounted on the COF substrate and including a first voltage circuit portion operating at a first voltage range and a second voltage circuit portion operating at a second voltage range higher than the first voltage range, the circuit portions being formed on a single chip, the second voltage circuit portion including a power semiconductor device,
- wherein the power semiconductor device includes:
- a plurality of terminal electrodes including a drain terminal electrode, a source terminal electrode, and a back gate terminal electrode and further including bumps configured as electrical connections and heat dissipation paths, wherein the bumps include a drain bump connected to the drain terminal electrode, a source bump connected to the source terminal electrode, and a guard ring bump connected to the back gate terminal electrode;
- and
- a guard ring region surrounding the periphery of the power semiconductor device and being connected to the back gate terminal electrode, wherein the guard ring bump is disposed in the guard ring region;
- and
- a resin layer for sealing the COF substrate and the semiconductor integrated circuit.
5 more elements
A display apparatus comprising:
- a semiconductor integrated circuit device comprising:
- a COF (Chip On Film) substrate;
- a semiconductor integrated circuit mounted on the COF substrate and including a first voltage circuit portion operating at a first voltage range and a second voltage circuit portion operating at a second voltage range higher than the first voltage range, the circuit portions being formed on a single chip;
- and
- a resin layer for sealing the COF substrate and the semiconductor integrated circuit;
- a display unit connected to the semiconductor integrated circuit device;
- and
- a PCB (Printed Circuit Board) arranged adjacent to the COF substrate and mounted thereon with discrete components connected to the semiconductor integrated circuit device.
5 more elements
Dependencies are inferred from the claim text.