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US 9,177,880 B2Granted
Housing for a semiconductor chip and semiconductor chip with a housing
AssigneeEpcos AG
InventorMichael Kubiak
Life of this patent
Estimating the term…
Abstract
A housing for a semiconductor chip has an injection molded body, in which an accommodating area for accommodating the semiconductor chip is provided. The injection-molded body has at least one metallization for making electrical contact with the semiconductor chip.
Claims20
A housing for a semiconductor chip, the housing comprising:
- an injection-molded body, in which an accommodating area for accommodating the semiconductor chip is provided, wherein the injection-molded body has a metallization configured to make electrical contact with the semiconductor chip;
- and
- an opening leading into the accommodating area, wherein the opening is closed by a membrane or a valve.
A device comprising:
- a semiconductor chip;
- an injection-molded body, in which an accommodating area for accommodating the semiconductor chip is provided, wherein the injection-molded body has a metallization configured to make electrical contact with the semiconductor chip;
- and
- an opening leading into the accommodating area, wherein the opening is closed by a membrane or a valve.
1 more element
A device comprising:
- an injection-molded body having an accommodating area;
- a semiconductor chip attached to the accommodating area of the injection-molded body;
- a metallization physically attached to the injection-molded body and electrically coupled to the semiconductor chip;
- an adhesive attaching the semiconductor chip to the accommodating area;
- and
- a cover closing the accommodating area to hermetically seal the semiconductor chip within the injection-molded body;
- and
- an opening leading into the accommodating area, wherein the opening is closed by a membrane or a valve.
5 more elements
Dependencies are inferred from the claim text.