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US 9,177,879 B2Granted
Sensor module
AssigneeInfineon Technologies AG
InventorsHorst Theuss, Bernd Stadler
Life of this patent
Estimating the term…
Abstract
A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.
Claims12
An assembly, comprising:
- a circuit board comprising electrical connection elements;
- a cap whose perimeter defines a rim, the rim being attached to a main surface of the circuit board, the cap comprising a planar surface;
- a first semiconductor chip attached to the planar surface of the cap and the main surface of the circuit board;
- a second semiconductor chip attached to the planar surface of the cap and the main surface of the circuit board;
- and
- the first and second semiconductor chips electrically connected to each other by at least one of the electrical connection elements,
- wherein a dimension of the first semiconductor chip equals a dimension of the second semiconductor chip in a direction perpendicular to the circuit board.
4 more elements
An assembly, comprising:
- a circuit board comprising electrical connection elements;
- a cap whose perimeter defines a rim, the rim being attached to a main surface of the circuit board, the cap comprising a planar surface;
- a first semiconductor chip having a backside attached to the planar surface of the cap and a front side attached to the connection elements of the circuit board;
- and
- a second semiconductor chip having a backside attached to the planar surface of the cap and a front side attached to the connection elements of the circuit board;
- wherein the first and second semiconductor chips are electrically connected to each other by at least one of the electrical connection elements.
3 more elements
Dependencies are inferred from the claim text.