Multi-chip package with offset die stacking and method of making same

A method of manufacturing a semiconductor device, comprising:

• providing a substrate having a plurality of electrical connections;
• mounting a first semiconductor die from a first group of semiconductor dice to the substrate such that a first plurality of bonding pads arranged along a first bonding edge of the first semiconductor die is oriented to face in a first direction;
• mounting the remaining semiconductor dice from the first group of semiconductor dice to the substrate such that:
• a first plurality of bonding pads arranged along a first bonding edge of each of the first group of semiconductor dice is oriented to face in the first direction;
• and
• each remaining semiconductor die of the first group of semiconductor dice is laterally offset relative to the first semiconductor die in a second direction opposite the first direction by a respective lateral offset distance;
• mounting a second group of semiconductor dice, intermixed with or over the first group of semiconductor dice, to the substrate such that:
• a first plurality of bonding pads arranged along a first bonding edge of each of the second group of semiconductor dice is oriented to face in the second direction;
• and
• each semiconductor die of the second group of semiconductor dice is laterally offset relative to the first semiconductor die in the first direction by a respective lateral offset distance;
• and
• connecting bond wires between the plurality of electrical connections of the substrate and the respective bonding pads of the first and second groups of semiconductor dice after mounting the first and second groups of semiconductor dice to the substrate.