Underfill dispensing with controlled fillet profile
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Chih Chuang, Chun-Hung Lin, Jung Wei Cheng, Tsung-Ding Wang
Life of this patent
Estimating the term…
Abstract
A method includes placing an underfill-shaping cover on a package component of a package, with a device die of the package extending into an opening of the underfill-shaping cover. An underfill is dispensed into the opening of the underfill-shaping cover. The underfill fills a gap between the device die and the package component through capillary. The method further includes, with the underfill-shaping cover on the package component, curing the underfill. After the curing the underfill, the underfill-shaping cover is removed from the package.
Claims19
A method comprising:
- placing an underfill-shaping cover on a package component of a package, wherein a device die of the package extends into an opening of the underfill-shaping cover;
- dispensing an underfill into the opening of the underfill-shaping cover, wherein the underfill fills a gap between the device die and the package component through capillary;
- with the underfill-shaping cover on the package component, curing the underfill;
- and
- after the curing the underfill, removing the underfill-shaping cover from the package.
A method comprising:
- placing an underfill-shaping cover over a plurality of package components, wherein a plurality of device dies is bonded to the plurality of package components, and wherein each of the plurality of device dies extends into one of a plurality of openings of the underfill-shaping cover;
- dispensing an underfill into the plurality of openings of the underfill-shaping cover, wherein the underfill encircles each of the plurality of device dies through capillary;
- curing the underfill;
- and
- after the curing the underfill, removing the underfill-shaping cover from the plurality of package components.
A method comprising:
- placing an underfill-dispensing tool set to contact a top surface of a package component of a package, wherein a device die of the package extends into an opening of the underfill-dispensing tool set, with the opening having slanted surfaces neither parallel to nor perpendicular to a top surface of the package component;
- dispensing an underfill over the underfill-dispensing tool set, wherein the underfill flows into the opening;
- with at least a portion of the underfill-dispensing tool set on the package component, curing the underfill;
- and
- after the curing the underfill, removing the underfill-dispensing tool set from the package.
Dependencies are inferred from the claim text.