Method of fabricating electronic circuit
AssigneeElectronics and Telecommunications Research Institute
InventorsSoon-Won Jung, Jae Bon Koo, Chan Woo Park, Bock Soon Na, Sang Chul Lim, Sang Seok Lee, Kyoung Ik Cho, Hye Yong Chu
Life of this patent
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Abstract
Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.
Claims18
A method of fabricating an electronic circuit, the method comprising:
- preparing a substrate including a device region and a wiring region;
- forming a polymer film on the substrate;
- patterning the polymer film to form a first polymer pattern on the device region of the substrate;
- and
- forming an electronic device on the first polymer pattern;
- forming a first metal wiring conformally on the wiring region, the first metal wiring being disposed on an upper surface of the first polymer pattern, between the first polymer pattern and the electronic device.
A method of fabricating an electronic circuit, the method comprising:
- preparing a first substrate;
- forming a sacrificial film and a polymer film on the substrate;
- patterning the polymer film to form a polymer pattern on the sacrificial film;
- forming a second substrate covering the polymer pattern on the sacrificial film;
- separating the second substrate from the sacrificial film to form the second substrate in which the polymer pattern is embedded;
- and
- forming an electronic device on the polymer pattern.
A method of fabricating an electronic circuit, the method comprising:
- preparing a substrate;
- forming a polymer film on the substrate;
- patterning the polymer film to form a polymer pattern;
- and
- forming an electronic device on the polymer pattern, including:
- forming a source electrode and a drain electrode on the polymer pattern;
- forming a semiconductor layer on the source electrode and the drain electrode;
- forming a gate insulating layer covering the source electrode, the drain electrode, and the semiconductor layer;
- and
- forming a gate electrode on the gate insulating layer.
A method of fabricating an electronic circuit, the method comprising:
- preparing a substrate including a device region and a wiring region, the device region being defined by the wiring region;
- forming a polymer film on the substrate;
- patterning the polymer film to form a polymer pattern;
- forming a repeating array of alternating concave and convex surfaces on the wiring region after the polymer pattern is formed;
- and
- forming an electronic device on the polymer pattern.
Dependencies are inferred from the claim text.