Method for manufacturing silicon substrate having textured structure
AssigneeTokuyama Corporation
InventorsHideki Umekawa, Shinji Matsui, Shinya Omoto
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AssigneeTokuyama Corporation
InventorsHideki Umekawa, Shinji Matsui, Shinya Omoto
Estimating the term…
The present invention provides a method for manufacturing a silicon substrate having texture structure, by which, in comparison with conventional methods, it is possible to reduce manufacturing step and form easily regular texture structure on silicon substrate surface. The method of the present invention comprises the steps of: (A) forming a pattern on the silicon substrate using a resin-comprising composition; (B) irradiating an etching gas to the silicon substrate surface other than the pattern portion; and (C) processing the silicon substrate irradiated with the etching gas with an alkaline etching fluid to form concave structure under the pattern portion. Furthermore, the present invention provides a resin-comprising composition usable in the method, in particular, a composition comprising photo-curable resin.
A method for manufacturing a silicon substrate having texture structure, said method comprising steps of:
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