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US 9,177,817 B2Granted
Methods for fabricating three-dimensional nano-scale structures and devices
AssigneeThe Research Foundation for The State University of New York
InventorsJohn G. Hartley, Ravi K. Bonam
Life of this patent
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Abstract
A method of fabricating a 3 dimensional structure, includes: forming a stack of at least 2 layers of photo resist material having different photo resist sensitivities upon a substrate; exposing the stack to beams of electromagnetic radiation or charged particles of different dosages to achieve selective solubility along a height of the stack; and dissolving soluble portions of the stack with a solvent to produce a 3 dimensional structure of desired geometry.
Claims38
A method for producing structures, the method comprising:
- depositing a plurality of layers of photo resist onto a substrate, the plurality of layers having an upper surface and at least one layer having a higher photo resist sensitivity than a photoresist sensitivity of at least one other layer of the plurality of layers;
- exposing a first area of the upper surface to a first beam of one of electromagnetic radiation and charged particles wherein a portion of each of the plurality of layers beneath the first area of the upper surface becomes substantially insoluble when contacted with a predetermined solvent;
- exposing a second area of the upper surface, contiguous with the first area, to a second beam of one of electromagnetic radiation and charged particles wherein a portion of the at least one layer having a higher photo resist sensitivity beneath the second area becomes substantially insoluble when contacted with the predetermined solvent;
- and
- contacting the plurality of layers with the predetermined solvent to dissolve soluble portions to provide the structure.
2 more elements
A method for producing structures, the method comprising:
- depositing a plurality of layers of photo resist onto a substrate, the plurality of layers having an upper surface and at least one layer having a higher photo resist sensitivity than a photo resist sensitivity of at least one other layer of the plurality of layers;
- preventing exposure of a first area of the upper surface to any beam of electromagnetic or charged particles to ensure that a portion of each of the plurality of layers beneath the first area of the upper surface is substantially insoluble when contacted with a predetermined solvent;
- exposing a second area of the upper surface, contiguous with the first area, to a first beam of one of electromagnetic radiation and charged particles wherein a portion of the at least one layer having a higher photo resist sensitivity beneath the second area becomes substantially soluble when contacted with the predetermined solvent;
- exposing at least one third area of the upper surface, contiguous with at least one of the first area and the second area, to a second beam of one of electromagnetic radiation and charged particles wherein a portion of each of the plurality of layers beneath the at least one third area becomes substantially soluble when contacted with the predetermined solvent;
- and
- contacting the plurality of layers with the predetermined solvent to dissolve the soluble portions to provide the structure.
3 more elements
A method of fabricating a 3 dimensional structure, comprising:
- forming a stack of at least 2 layers of photo resist material having different photo resist sensitivities upon a substrate;
- exposing the stack to beams of electromagnetic radiation or charged particles of different dosages to achieve selective solubility along a height of the stack, wherein said exposing comprises at least one of:
- (1) when the at least 2 layers of photo resist material have a negative tone,
- exposing a first area of an upper surface of the stack to a first beam of one of electromagnetic radiation and charged particles wherein a portion of each of the at least 2 layers beneath the first area of the upper surface becomes substantially insoluble when contacted with a predetermined solvent,
- exposing a second area of the upper surface, contiguous with the first area, to a second beam of one of electromagnetic radiation and charged particles when a portion of at least one layer having a higher photo resist sensitivity beneath the second area becomes substantially insoluble when contacted with the predetermined solvent;
- and
- (2) when the at least 2 layers of photo resist material have a positive tone,
- preventing exposure of a first area of an upper surface of the stack to any beam of electromagnetic or charged particles to ensure that a portion of each of the at least 2 layers beneath the first area of the upper surface is substantially insoluble when contacted with a predetermined solvent,
- exposing a second area of the upper surface, contiguous with the first area, to a first beam of one of electromagnetic radiation and charged particles wherein a portion of at least one layer having a higher photo resist sensitivity beneath the second area become substantially soluble when contacted with the predetermined solvent, and
- exposing at least one third area of the upper surface, contiguous with at least one of the first area and the second area, to a second beam of one of electromagnetic radiation and charged particles wherein a portion of each of the at least 2 layers beneath the at least one third area becomes substantially soluble when contacted with the predetermined solvent;
- and
- dissolving soluble portions of the stack with the predetermined solvent to produce a 3 dimensional structure of desired geometry.
9 more elements
Dependencies are inferred from the claim text.