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US 9,177,715 B2Granted
System and method for inductive wireless signaling
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJun-De Jin, Fan-Ming Kuo, Huan-Neng Chen, Ming Hsien Tsai, Hsieh-Hung Hsieh, Tzu-Jin Yeh
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Abstract
A transformer includes first and second semiconductor substrates. The first semiconductor substrate includes a first circuit, a first coil providing a first impedance, and a first capacitor coupled in parallel with the first coil. The second semiconductor substrate includes a second circuit, a second coil providing a second impedance and inductively coupled with the first coil, and a second capacitor coupled in parallel with the second coil.
Claims20
A transformer comprising:
- a first semiconductor substrate underlying a first circuit, a first coil providing a first impedance, and a first capacitor coupled in parallel with the first coil, wherein the first coil and an electrode of the first capacitor are disposed in a first layer above the first semiconductor substrate;
- and
- a second semiconductor substrate underlying a second circuit, a second coil providing a second impedance and inductively coupled with the first coil, and a second capacitor coupled in parallel with the second coil, wherein the second coil and an electrode of the second capacitor are disposed in a second layer above the second semiconductor substrate;
- wherein the first capacitor is positioned above the second capacitor.
1 more element
A method comprising:
- forming a first circuit, a first coil having a first impedance, and a first capacitor above a first semiconductor substrate, wherein the first capacitor is coupled in parallel with the first coil, and an electrode of the first capacitor and the first coil are disposed in a first layer above the first semiconductor substrate;
- forming a second circuit, a second coil having a second impedance, and a second capacitor above a second semiconductor substrate, wherein the second capacitor is coupled in parallel with the second coil, wherein the first capacitor is formed above the second capacitor, and wherein the second coil and an electrode of the second capacitor are disposed in a second layer above the second semiconductor substrate;
- and
- aligning the first and second semiconductor substrates, so that the respective coils of the aligned substrates are inductively coupled.
1 more element
Dependencies are inferred from the claim text.