Fingerprint sensing assemblies and methods of making
AssigneeSynaptics Incorporated
InventorFred G Benkley, III
Life of this patent
Estimating the term…
Abstract
A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.
Claims20
A fingerprint sensing module comprising:
- a sensor substrate having a sensor substrate sensing side surface on one side of the substrate configured to receive a finger contact in a finger contact region of the sensor substrate sensing side and a sensor substrate circuit side surface on the opposite side of the substrate from the sensor substrate sensing side;
- an image sensor including conductive traces formed on the sensor substrate circuit side surface of the sensor substrate, in the finger contact region of the sensor substrate, wherein the sensor substrate intermediate the sensor substrate sensing side surface and the sensor substrate circuit side surface insulates the conductive traces from a finger of a user during the finger contact in the finger contact region of the sensor substrate;
- and
- a sensor circuit including at least one integrated circuit separated from the image sensor conductive traces of the image sensor in the finger contact region of the sensor substrate structure and electrically connected to the conductive traces of the image sensor in the finger contact region of the sensor substrate circuit side.
A fingerprint sensing module comprising:
- a sensor substrate having a sensing side to receive a finger contact and a circuit side, opposite the sensing side;
- an image sensor including conductive traces formed on the circuit side of the sensor substrate, wherein the sensor substrate isolates the conductive traces from the finger contact;
- and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate separated from the conductive traces and electrically connected to the image sensor.
A fingerprint sensing module comprising:
- a flexible substrate having a sensing side to receive a finger contact and a circuit side, opposite the sensing side;
- an image sensor including conductive traces formed on the circuit side of the flexible substrate, wherein the flexible substrate isolates the conductive traces from the finger contact;
- a sensor circuit including at least one integrated circuit mounted on the circuit side of the flexible substrate separated from the conductive traces and electrically connected to the image sensor;
- and a rigid substrate, wherein the flexible substrate is affixed to the rigid substrate.
Dependencies are inferred from the claim text.