Methods and systems for address mapping between host and expansion devices within system-in-package (SiP) solutions
AssigneeFreescale Semiconductor, Inc.
InventorGary L. Miller
Life of this patent
Estimating the term…
Abstract
Methods and systems are disclosed for address mapping between die-to-die-port (DTDP) host devices and DTDP expansion devices for combined system-in-package (SiP) solutions. Interconnect circuitry having a plurality of ports is configured to provide communication from the host device to the expansion device so that the expansion device appears to be resident on the host device. Configurable address mapping is used to re-configure the host memory map to include expansion memory map details in a seamless fashion. Further, direct circuit interconnection blocks (e.g., using copper pillar (CuP) connectors) can be used to improve connectivity and performance.
Claims22
A die-to-die port (DTDP) system having plug-and-play connectivity, comprising:
- a DTDP host device within a first integrated circuit;
- and
- a DTDP expansion device within a second integrated circuit;
- the DTDP host device within the first integrated circuit, comprising:
- port interconnect circuitry having a plurality of ports and decode circuitry, the decode circuitry being configured to direct communications between the plurality of ports based upon a host address map;
- and
- a circuit interconnection block coupled to the port interconnect circuitry and being configured to provide interconnectivity to the DTDP expansion device using at least one of the plurality of ports;
- and
- the DTDP expansion device within the second integrated circuit, comprising:
- an expansion circuit block configured to provide expansion functionality for the DTDP host device;
- and
- a circuit interconnection block coupled to the port interconnect circuitry and being configured to provide interconnectivity to the DTDP host device;
- wherein the DTDP expansion device is further configured to provide expansion device information to the DTDP host device during start-up or reset;
- and
- wherein the DTDP host device is further configured to re-configure the host address map based upon the expansion device information so that the decode circuitry is configured to provide communications to the DTDP expansion device as if the DTDP expansion device were resident on the DTDP host device.
A method for providing plug-and-play connectivity for a die-to-die port (DTDP) system, comprising:
- providing connectivity between a plurality of ports using port interconnect circuitry within a DTDP host device within a first integrated circuit;
- using decode circuitry for the port interconnect circuitry to direct communications within the port interconnect circuitry based upon a host address map;
- utilizing a circuit interconnection block within the DTDP host device to provide interconnectivity to a DTDP expansion device using at least one of the plurality of ports;
- utilizing a circuit interconnection block within the DTDP expansion device to provide interconnectivity to the DTDP host device, the DTDP expansion device being within a second integrated circuit;
- communicating expansion device information from the DTDP expansion device to the DTDP host device during start-up or reset;
- and
- re-configuring the host address map based upon the expansion device information so that the decode circuitry communicates with the DTDP expansion device as if the DTDP expansion device were resident on the DTDP host device.
Dependencies are inferred from the claim text.