Method of forming patterns
AssigneeFUJIFILM Corporation
InventorHideaki Tsubaki
Life of this patent
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Abstract
A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film, wherein the resist composition contains a resin capable of increasing the polarity by the action of the acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) forming a protective film on the resist film with a protective film composition after forming the resist film and before exposing the resist film, (c) exposing the resist film via an immersion medium, and (d) performing development with a negative developer.
Claims18
A method of forming patterns, comprising:
- (a) coating a substrate with a resist composition for negative development to form a resist film, wherein the resist composition contains a resin capable of increasing its polarity by the action of the acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation,
- (b) forming a protective film on the resist film with a protective film composition after forming the resist film and before exposing the resist film,
- (c) exposing the resist film via an immersion medium, and
- (d) performing development with a negative developer,
- wherein:
- the resin has an acid-decomposable group;
- and
- the development step (d) with the negative developer removes non-exposed portions of the resist film not irradiated with an actinic ray or radiation.
Dependencies are inferred from the claim text.