Continuity test in electronic devices with multiple-connection leads

An electronic device comprising:

• an electronic component comprising a set of first terminals and a set of second terminals;
• a protective package surrounding the electronic component;
• a set of first leads and a set of second leads exposed from the protective package;
• a first electrical connection inside the protective package between each first lead and a corresponding one of the first terminals;
• a plurality of second electrical connections inside the protective package each one between the second lead and a corresponding one of the second terminals;
• said electronic component comprising a plurality of test structures for each second lead, each test structure being coupled between a corresponding one of the second terminals connected to the second lead and a corresponding test one of the first terminals connected to a test one of the first leads;
• each test structure comprising a non-volatile memory cell being selectively configurable in a test condition for testing the corresponding second electrical connection through the second lead and the test first lead.

An electronic device comprising:

• an electronic component comprising a set of first terminals and a set of second terminals;
• a protective package;
• a set of first leads and a set of second leads exposed from the protective package;
• a first electrical connection inside the protective package between each first lead and a corresponding one of the first terminals;
• a plurality of second electrical connections inside the protective package each one between the second lead and a corresponding one of the second terminals;
• said electronic component comprising a plurality of test structures for each second lead, each test structure being coupled between a corresponding one of the second terminals connected to the second lead and a corresponding test one of the first terminals connected to a test one of the first leads;
• each test structure comprises an interconnection element being configurable in a test condition for testing the corresponding second electrical connection through the second lead and the test first lead.

A method for testing an electronic device comprising at least one electronic component comprising a set of first terminals and a set of second terminals;

• a protective package;
• a set of first leads and a set of second leads exposed from the protective package;
• a first electrical connection inside the protective package between each first lead and a corresponding one of the first terminals;
• and a plurality of second electrical connections inside the protective package each one between the second lead and a corresponding one of the second terminals;
• the at least one electronic component comprising a plurality of test structures for each second lead, each test structure being coupled between a corresponding one of the second terminals connected to the second lead and a corresponding test one of the first terminals connected to a test one of the first leads;
• the method comprising:
• testing each second electrical connection through the corresponding second lead and test first lead with the corresponding test structure configured in a test condition;
• and
• switching each test structure from the test condition to an operative condition.