Active probe card for electrical wafer sort of integrated circuits

A testing apparatus, comprising:

• a tester;
• a probe card electrically coupled to the tester;
• an active interposer coupled to the probe card and configured to be wirelessly coupled with a device to be tested that includes a plurality of pads, said active interposer including:
• a free surface configured to face the device;
• a plurality of pads positioned on the free surface and configured to respectively face the pads of the device and to be separated from the pads of the device by a dielectric, each pad of the active interposer being configured to form, with the respective pad of the device, an elementary wireless coupling element that allows a wireless transmission between the active interposer and the device;
• and
• an amplifier circuit configured to amplify wireless signals from the device and forward the amplified wireless signals to the tester;
• and
• a transmission element coupled to the active interposer and configured to transmit a supply voltage to the device.

An active interposer for a testing apparatus for testing a device that includes a plurality of pads, the active interposer comprising:

• a body configured to be coupled to a probe card of the testing apparatus, the body including a free surface configured to face the device;
• a plurality of pads positioned on the free surface and configured to respectively face the pads of the device and to be separated from the pads of the device by a dielectric, each pad of the active interposer being configured to form, with the respective pad of the device, an elementary wireless coupling element that allows a wireless transmission between the active interposer and the device;
• an amplifier circuit configured to amplify wireless signals from the device and forward the amplified wireless signals to the tester;
• and
• a transmission element configured to transmit a supply voltage to the device.