Micro-electromechanical structure with low sensitivity to thermo-mechanical stress
AssigneeMaxim Integrated Products, Inc.
InventorsBarbara Simoni, Luca Coronato, Gabriele Cazzaniga
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AssigneeMaxim Integrated Products, Inc.
InventorsBarbara Simoni, Luca Coronato, Gabriele Cazzaniga
Estimating the term…
The invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of compensating the effect of the thermo-mechanical stress by incorporating and adjusting elastic elements that are used to couple a moveable proof mass to anchors. The proof mass responds to acceleration by displacing and tilting with respect to a moveable mass rotational axis. The thermo-mechanical stress is accumulated in the structure during the courses of manufacturing, packaging and assembly or over the structure's lifetime. The stress causes a displacement on the proof mass. A plurality of elastic elements is coupled to support the proof mass. Geometry and configuration of these elastic elements are adjusted to reduce the displacement caused by the thermo-mechanical stress.
A microelectromechanical structure, comprising:
A method of compensating thermo-mechanical stress accumulated in a microelectromechanical structure, comprising the steps of:
An out-of-plane accelerometer, comprising:
Dependencies are inferred from the claim text.