Pattern inspection method and pattern inspection apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsTakayoshi Fujii, Kiminori Yoshino, Makoto Kaneko, Yusaku Konno, Yusuke Iida
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AssigneeKabushiki Kaisha Toshiba
InventorsTakayoshi Fujii, Kiminori Yoshino, Makoto Kaneko, Yusaku Konno, Yusuke Iida
Estimating the term…
In accordance with an embodiment, a pattern inspection method includes applying a light to a substrate including an inspection target pattern in a plurality of optical conditions, detecting a reflected light from the substrate to acquire a pattern image for each of the optical conditions, outputting a gray value difference between the pattern image and a reference image for each of the optical conditions, and specifying a position of the defect in a stacking direction of the stacked film from a relation of the obtained gray value difference between the optical conditions. The pattern is formed by a stacked film, the optical conditions includes at least a first optical condition for detection of a defect on a surface of the stacked film.
A pattern inspection method comprising:
A pattern inspection apparatus comprising:
A pattern inspection apparatus comprising:
Dependencies are inferred from the claim text.