Multi-layer mesh wicks for heat pipes

An electronic device, comprising:

• a substrate in thermal contact with at least one electronic component;
• a heat pipe body having an inner cavity formed in or on said substrate;
• and
• a wick structure disposed in said inner cavity, said wick structure comprising at least a first woven mesh layer and at least a second woven mesh layer disposed on said first woven mesh layer,
• wherein said first woven mesh layer comprises a first weave pattern of thermally conductive fibers having a first warp direction, wherein said second woven mesh layer comprises a second weave pattern of thermally conductive fibers having a second warp direction, and wherein said second woven mesh layer is disposed on said first woven mesh layer such that said first and said second warp directions are rotationally offset by an inter-layer warp offset angle (γ1) greater than 2.5 degrees and less than 87.5 degrees;
• and
• wherein said wick structure further comprises a third woven mesh layer disposed on said second woven mesh layer, wherein said third woven mesh layer comprises a third weave pattern of thermally conductive fibers having a third warp direction, and wherein said third woven mesh layer is disposed on said second woven mesh layer such that at least one of said first and said second warp direction are rotationally offset from said third warp direction by a second inter-layer warp offset angle (γ2) greater than 2.5 degrees and less than 87.5 degrees, and wherein a relative magnitude difference between γ1 and γ2 is greater than 2.5 degrees.