Heat sink assembly for opto-electronic components and a method for producing the same
AssigneeLight Therm Oy
InventorsKimmo Jokelainen, Ville Moilanen, Howard Rupprecht
Life of this patent
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Abstract
The invention relates to a heat sink assembly and a method for producing the same. The invention can be applied, for example, in solid state lighting in order to improve the efficiency of heat dissipation. The object of the invention is achieved with a solution where effective thermal connection is provided from opto-electrical component in which thermally active inserts are embedded in an injection moulding to plastic heat sink. Solution of the invention can also provide also electrical connections for opto-electrical components.
Claims25
A heat sink assembly for dissipating heat from a replacement LED, wherein the heat sink assembly comprises:
- an injection moulded, plastic heat sink with a heat dissipating plastic heat sink surface and emissivity;
- at least one combined thermally and electrically active insert, the at least one combined insert comprising a thermally active part that is not electrically active having a free form shape and an electrically active part;
- at least one electrically active insert;
- the at least one combined insert and the at least one electrically active insert providing an interface with the plastic heat sink, the interface configured to conduct and disperse heat from the at least one combined insert and the at least one electrically active insert to the plastic heat sink;
- a first exposed area at a surface of the at least one combined insert and the at least one electrically active insert for thermal and electrical connection to the replacement LED;
- a power supply disposed in a recess of the plastic heat sink;
- and
- a second exposed area on a surface of the at least one combined insert and at the least one electrically active insert for electrical connection to the power supply;
- wherein a thermal connection from the first exposed area for connecting the replacement LED to the surface of the plastic heat sink comprises the at least one combined insert and plastic heat sink material.
A method for producing a heat sink assembly for a replacement LED, comprising:
- forming an injection moulded plastic heat sink structure;
- forming a heat dissipating surface area;
- producing at least one combined thermally and electrically active insert, wherein the combined insert comprises a thermally active part that is not electrically active having a free form shape and an electrically active part;
- producing at least one electrically active insert,
- the at least one combined insert and the electrically active insert forming an interface with the plastic heat sink material for heat dispersion and conduction;
- wherein at least two first exposed areas at surfaces of the at least one combined insert and the electrically active insert are configured to provide electrical and thermal connections to the replacement LED;
- embedding the at least one combined insert and electrically active insert the at least partly inside the heat sink, wherein the at least one combined and at least one electrically active embedded inserts are configured to provide a first exposed area at the surface of the at least one combined and at least one electrically active embedded inserts for electrical connection to the replacement LED;
- directly soldering the replacement LED to the first exposed areas of the at least one combined and at least one electrically active inserts;
- providing second exposed areas at the at least one combined and the at least one electrically active insert for electrical connection to a power supply printed circuit board;
- providing a recess in the heat sink structure for a power supply unit, the recess being configured to provide the second exposed areas for electrical connection to the power supply printed circuit board;
- and
- wherein a thermal connection from the exposed heat sink area for connecting the replacement LED to the heat sink surface comprises the at least one combination insert and plastic heat sink material.
Dependencies are inferred from the claim text.