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US 9,175,413 B2Granted
Copper electroplating solution and method of copper electroplating
AssigneeRohm and Haas Electronic Materials LLC
InventorsMutsuko Saito, Makoto Sakai, Toshiyuki Morinaga, Shinjiro Hayashi
Life of this patent
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Abstract
A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating.
Claims3
A method of copper electroplating comprising:
- a) providing a base comprising vias, through-holes or vias and through-holes;
- b) immersing the base comprising the vias, through-holes or vias and through-holes in a copper electroplating solution comprising water soluble copper compounds selected from the group consisting of copper sulfate and copper pyrophosphate;
- ninhydrin;
- and compounds selected from the group consisting of:
- M-SO3—(CH2)a—S—(CH2)b—SO3-M ;
- (1)
- M-SO3—(CH2)a—O2—CH2—S—CH2—O—(CH2)b—SO3-M;
- (2)
- M-SO3—(CH2)a—S—S—(CH2)b—SO3-M;
- (3)
- M-SO3—(CH2)a—O—CH2—S—S—CH2—O—(CH2)b—SO3-M;
- (4)
- M-SO3—(CH2)a—S—C(═S)—S—(CH2)b—SO3-M;
- (5)
- M-SO3—(CH2)a—O—CH2—S—C(═S)—S—CH2—O—(CH2)b—SO3-M;
- (6)
- wherein a and b in compounds (1)-(6) are integers from 3 to 8, M is hydrogen or an alkali metal element;
- and
- c) electroplating copper on the base and in the vias, or through-holes or in the vias and through-holes.
16 more elements
Dependencies are inferred from the claim text.