Etching agent for copper or copper alloy
AssigneeAdvanced Technology Materials, Inc.
InventorsTsutomu Kojima, Yukichi Koji
Life of this patent
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Abstract
Object is to provide an etching solution which generates less foam and can etch copper or copper alloy at high selectivity when used in a step of etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel. The etching solution to be used in a step of selectively etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel has, as essential components thereof, (A) a linear alkanolamine, (B) a chelating agent having an acid group in the molecule thereof, and (C) hydrogen peroxide.
Claims17
An etching solution for copper or copper alloy to be used in a step of selectively etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel, said etching solution comprising (A) a linear alkanolamine, (B) a chelating agent having an acid group in the molecule thereof, and (C) hydrogen peroxide, wherein a weight ratio of the chelating agent (B) to the linear alkanolamine (A),((B)/(A)) is from 1 to 100.
Dependencies are inferred from the claim text.