Back to results
US 9,175,399 B2Granted
Plating bath for electroless deposition of nickel layers
AssigneeAtotech Deutschland GmbH
InventorsHeiko Brunner, Jan Picalek, Iulia Bejan, Carsten Krause, Holger Bera, Sven Rückbrod
Life of this patent
Estimating the term…
Abstract
The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilizing agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.
Claims19
An aqueous plating bath composition for electroless deposition of nickel and nickel alloys, the plating bath comprising
- (i) a source of nickel ions,
- (ii) at least one complexing agent,
- (iii) at least one reducing agent, and
- (iv) a stabilising agent according to formula (1):
- wherein X is selected from the group consisting of O and NR4, n ranges from 1 to 6, m ranges from 1 to 8;
- R1, R2, R3 and R4 are independently selected from the group consisting of hydrogen and C1 to C4 alkyl;
- Y is selected from the group consisting of —SO3R5, —CO2R5 and —PO3R52, and R5 is selected from the group consisting of hydrogen, C1-C4 alkyl and a suitable counter ion wherein the concentration of the stabilizing agent according to formula (1) ranges from 0.02 to 5.0 mmol/l.
4 more elements
Dependencies are inferred from the claim text.