Atomic layer deposition chamber with multi inject
AssigneeApplied Materials, Inc.
InventorsJoseph Yudovsky, Anh N. Nguyen, Tai T. Ngo
Life of this patent
Estimating the term…
Abstract
Embodiments of the invention relate to apparatus and methods for depositing materials on substrates during atomic layer deposition processes. In one embodiment, a chamber lid assembly comprises a channel having an upper portion and a lower portion, wherein the channel extends along a central axis, a housing having an inner region and at least partially defining two or more annular channels, an insert disposed in the inner region and defining the upper portion, the upper portion fluidly coupled with the two or more annular channels, and a tapered bottom surface extending from the bottom portion of the channel to a peripheral portion of the chamber lid assembly.
Claims18
A chamber lid assembly comprising:
- a lid having:
- a channel having an upper portion and a lower portion, wherein the channel extends along a central axis of the lid;
- a housing having an inner region and at least partially defining two or more annular channels surrounding the channel;
- and
- a tapered bottom surface extending from the lower portion of the channel to a peripheral portion of the chamber lid assembly;
- and
- an insert comprising a coupling lid having a truncated portion, the insert configured to at least partially define the upper portion of the channel to provide a desired gas flow characteristic into the upper portion of the channel and having a plurality of apertures formed therein disposed adjacent the two or more annular channels in the housing, the plurality of apertures fluidly coupled with the two or more annular channels.
Dependencies are inferred from the claim text.