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US 9,175,368 B2Granted
MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
AssigneeIndium Corporation
InventorsWeiping Liu, Ning-Cheng Lee
Life of this patent
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Abstract
A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.
Claims15
A solder, consisting of:
- between 0.3 wt. % and 0.7 wt. % Ag;
- between 0.7 wt. % and 1.5 wt. % Cu;
- between 0.001 wt. % and 0.09 wt. % Mn;
- and
- a remainder of Sn.
2 more elements
A solder consisting of:
- about 0.5 wt. % Ag;
- about 1.0 wt. % Cu;
- about 0.05 wt. % Mn;
- and
- a remainder of Sn.
2 more elements
A solder consisting of:
- between 0.3 wt. % and 0.7 wt. % Ag;
- between 0.8 wt. % and 1.1 wt. % Cu;
- between 0.03 wt. % and 0.08 wt. % Mn;
- and
- a remainder of Sn.
2 more elements
Dependencies are inferred from the claim text.