US 9,175,151 B2 · Resin composition and method for producing circuit board

Abstract

The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Claims1

Dependent claims

A resin composition comprising:

a copolymer comprising of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer;
and
an ultraviolet absorber,
wherein, when the resin composition forms a resin film and when ∈1 represents an absorbance coefficient per unit weight of a resin film in a solution prepared by dissolving the resin film in a solvent, ∈1 at a light wavelength at which the resin film is to be irradiated is at least 0.01 (L/(g·cm)), and
wherein the resin film has acid resistance and swells or dissolves in an alkaline solution.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/496,709Filed 25 Sep 2014 · division

Priority

JP 2011-11465223 May 2011

Published

US 2015/0008379 A18 Jan 2015

Granted

3 Nov 2015

Term ends

Not estimatedThe source records don’t support an estimate.

Classification21 codes

C08K 5/3475
Five-membered rings: condensed with carbocyclic rings
C08L 33/02
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon…:…
C09D 125/08
Homopolymers or copolymers of styrene: copolymers of styrene
C09D 133/08
Of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical: homopolymers or…

Family

PCT/JP2011/006604Parent of this division · filed 28 Nov 2011

US 2015/0008379 A1Pre-grant publication · published 8 Jan 2015

Application14/002,970Parent of this division

US 8,877,843 B2Parent of this division

US 2013/0337188 A1Published application

US 9,175,151 B2This patent

From the US filing history. Foreign family members aren’t listed.

Resin composition and method for producing circuit board

Life of this patent

Resin composition and method for producing circuit board

Life of this patent

Abstract

Claims1