Liquid ejecting head, liquid ejecting apparatus, piezoelectric element, and method for manufacturing piezoelectric element
AssigneeSeiko Epson Corporation
InventorNoboru Furuya
Life of this patent
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Abstract
A flow channel substrate has pressure chambers, and the pressure chambers communicate with nozzle openings configured to eject liquid. Each of piezoelectric elements on the flow channel substrate has a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to the electrodes. The wiring layer has a first layer on the flow channel substrate side and a second layer on the first layer. The first layer contains palladium and is formed by pretreatment, whereas the second layer contains nickel and is formed by electroless plating.
Claims11
A liquid ejecting head comprising:
- a flow channel substrate, the flow channel substrate including a pressure chamber communicating with a nozzle opening configured to eject liquid;
- and
- a piezoelectric element, the piezoelectric element provided to the flow channel substrate and having a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to at least one of the electrodes,
- the wiring layer including:
- a first layer containing palladium,
- a second layer on the first layer, the second layer containing nickel,
- a third layer on the second layer, the third layer containing palladium, and
- a fourth layer on the third layer, the fourth layer containing gold.
A piezoelectric element comprising:
- a piezoelectric layer;
- a pair of electrodes;
- and
- a wiring layer coupled to at least one of the electrodes,
- the wiring layer including:
- a first layer containing palladium,
- a second layer on the first layer, the second layer containing nickel,
- a third layer on the second layer, the third layer containing palladium, and
- a fourth layer on the third layer, the fourth layer containing gold.
A method for manufacturing a piezoelectric element having a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to the electrodes, the method comprising:
- forming a mask on the electrodes with the electrodes exposed, the mask perforated at least in a region where the wiring layer is to be formed;
- forming a palladium-containing first layer by pretreatment;
- removing the mask;
- and
- forming a nickel-containing second layer on the first layer by electroless plating.
Dependencies are inferred from the claim text.