Positioning mechanism and bonding device using the same

A bonding device for bonding two or more workpieces, comprising:

• a platform;
• a first bonding mechanism mounted on the platform;
• and
• a positioning mechanism mounted on the platform, the positioning mechanism comprising:
• a loading assembly, and
• a clamping assembly comprising:
• a driver mounted on a bottom of the loading assembly;
• at least two sliding members driven by the driver;
• and
• at least two clamping subassemblies mounted on a top of the loading assembly, wherein the at least two clamping subassemblies are divided into two groups, the two groups of the at least two clamping subassemblies are arranged and mounted adjacent to opposite sides of the loading assembly, and the at least two sliding members are connected to the two groups of the clamping subassemblies, respectively, the driver is capable of driving the at least two sliding members to move away from or toward each other to enable the two groups of the clamping subassemblies to move toward or away from the loading assembly to clamp or release a first workpiece on the loading assembly, such that the first bonding mechanism is capable of bonding the second workpiece to the first workpiece cooperatively.