Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece

A method for simultaneously slicing a multiplicity of wafers from a substantially circular-cylindrical workpiece that is connected to a sawing strip, the method comprising:

• executing a relative movement between the workpiece and a wire gang of a wire saw in a direction perpendicular to a longitudinal axis of the workpiece with the aid of a forward feed device with a defined forward feed rate, by which the workpiece is guided through the wire gang so as to be sliced into a plurality of wafers;
• and
• varying the forward feed rate through the course of the method including:
• setting the forward feed rate to a value v1 at a cutting depth of 50% of the workpiece diameter;
• after reaching the cutting depth of 50% , increasing the forward feed rate to a value v2 ≧1.15×v1 as a local maximum;
• subsequently to increasing the forward feed rate to the local maximum, decreasing the forward feed rate to a value v3 <v1 at a time when the wire gang first comes into contact with the sawing strip;
• and
• subsequent to coming into contact with the sawing strip, increasing the forward feed rate to a value v5>v3.