Polishing apparatus with polishing head cover
AssigneeEbara Corporation
InventorsMasao Umemoto, Tadakazu Sone, Ryuichi Kosuge, Hideo Aizawa
Life of this patent
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Abstract
A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover.
Claims17
A polishing apparatus comprising:
- a polishing table configured to hold a polishing tool having a polishing surface;
- a polishing head having a top ring configured to press a substrate against the polishing surface;
- a polishing head cover configured to cover the polishing head;
- a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover;
- and
- a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover.
A polishing apparatus comprising:
- a polishing table configured to hold a polishing tool having a polishing surface;
- a polishing head having at least:
- a top ring configured to hold and press a substrate against the polishing surface,
- a top ring shaft to which the top ring is fixed,
- a top ring elevating mechanism to elevate the top ring through the top ring shaft, and
- a top ring arm on which the top ring elevating mechanism is provided,
- a polishing head cover configured to cover the top ring shaft, the top ring elevating mechanism, the top ring arm, and an upper part of the top ring;
- and
- cleaning liquid supply ports configured to supply a cleaning liquid to an outer surface of the polishing head cover;
- wherein the cleaning liquid supply ports are provided at an upper part of the polishing head cover and are arranged so as to surround the outer surface of the polishing head cover.
A polishing apparatus comprising:
- a polishing table configured to hold a polishing tool having a polishing surface;
- a polishing head having a top ring configured to press a substrate against the polishing surface;
- a polishing head cover configured to cover the polishing head;
- and
- cleaning liquid supply ports configured to supply a cleaning liquid to an inner surface of the polishing head cover;
- wherein the cleaning liquid supply ports are provided at the inside of the polishing head cover and are arranged so as to be along the inner surface of the polishing head cover.
Dependencies are inferred from the claim text.