Substrate cutting apparatus and method for cutting substrate using the same
AssigneeSamsung Display Co., Ltd.
InventorsHyun-Chul Lee, Won-Kyu Lim, Joon-Hyung Kim, Jae-Seok Park, Cheol-Lae Roh
Life of this patent
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Abstract
A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.
Claims19
A substrate cutting apparatus, comprising:
- a stage configured to support a substrate;
- a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam;
- and
- a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit swinging the first laser beam in a predetermined light irradiating section on the substrate and to reciprocate a beam spot formed by the first laser beam in the predetermined light irradiating section a multiple number of times so as to provide intermittent irradiation to a spot region of the predetermined light irradiating section, the light irradiating section on the substrate including a curved line section,
- wherein:
- the beam swing unit includes a reflection unit and a driver, the reflection unit including a reflection surface reflecting the first laser beam emitted from the first laser generator toward the substrate, and the driver driving the reflection unit,
- the driver includes a first rotation shaft and a second rotation shaft intersecting the first rotation shaft, the first and second rotation shafts being parallel with the reflection surface, and
- the driver controls a motion of the reflection unit through the first rotation shaft and the second rotation shaft to swing the first laser beam according to the curved line section.
A substrate cutting method, comprising:
- mounting a substrate on a stage;
- irradiating a first laser beam toward the substrate by a first laser generator, the first laser beam being a short-pulse laser beam;
- swinging the first laser beam by a beam swing unit in a predetermined light irradiating section on the substrate to reciprocate a beam spot formed by the first laser beam in the predetermined light irradiating section a multiple number of times so as to provide intermittent irradiation to a spot region of the predetermined light irradiating section, the beam swing unit being on a beam path of the first laser beam, and the light irradiating section on the substrate including a curved line section;
- and
- moving the light irradiating section according to an imaginary cutting line of the substrate by transferring at least one of the beam swing unit and the stage,
- wherein:
- the beam swing unit includes a reflection unit and a driver, the reflection unit including a reflection surface reflecting the first laser beam emitted from the first laser generator toward the substrate, and the driver driving the reflection unit,
- the driver includes a first rotation shaft and a second rotation shaft intersecting the first rotation shaft, the first and second rotation shafts being parallel with the reflection surface, and
- the driver controls a motion of the reflection unit through the first rotation shaft and the second rotation shaft to swing the first laser beam according to the curved line section.
Dependencies are inferred from the claim text.