A method of assembling an implantable electroacupuncture device (IEAD) in a coin-sized and coin-shaped hermetically-sealed, housing having a diameter of no more than 25 mm and a thickness of no more than 2.5 mm, the housing having at least one feed-through pin assembly radially passing through an edge wall of the coin-sized and coin-shaped thin housing, the IEAD being adapted for use in treating mental disorders of a patient, the method comprising the steps of:
- (a) forming a thin coin-sized and coin-shaped housing having a bottom case and a top cover plate, the bottom case having an edge wall around its perimeter that extends at right angles from the bottom case, the edge wall having a height no more than 2.5 mm, the top cover plate being adapted to fit over an upper edge of the edge wall;
- (b) forming a recess in the edge wall of the coin-sized and coin-shaped housing;
- (c) placing a feed-through assembly within the recess so that a feed-through pin of the feed-through assembly electrically passes through the edge wall of the recess at a location that is separated from where the edge wall of the housing is designed to contact the top cover plate;
- (d) placing electronic pulse generation circuitry and a primary battery within the space bounded by the bottom case and the perimeter edge wall, including electrically connecting the pulse generation circuitry to one end of the feed-through pin;
- and
- (e) welding the top cover plate to the upper edge of the edge wall, thereby hermetically sealing the pulse generation circuitry and primary battery within the coin-sized and coin-shaped housing.