RFID inlay incorporating a ground plane
AssigneeAvery Dennison Corporation
InventorIan J. Forster
Life of this patent
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Abstract
An RFID inlay. The RFID inlay can include a substrate having a first area and a second area, a conductive structure having a first part disposed over at least a portion of the first area and a second part disposed over at least a portion of the second area, and a dielectric material disposed over at least a portion of the conductive structure, wherein the substrate is adapted to be folded such that the first part of the conductive structure is disposed over the second part of the conductive structure and the dielectric material is disposed between the first part and the second part.
Claims15
An RFID inlay, comprising:
- a substrate having a first area and a second area;
- a conductive structure having a first part disposed over at least a portion of the first area and a second part disposed over at least a portion of the second area;
- and
- a dielectric material disposed over at least a portion of the conductive structure;
- wherein the inlay is provided in a flat configuration and is adapted to be folded such that the first part of the conductive structure is disposed over the second part of the conductive structure and the dielectric material is disposed between the first part and the second part and the first part of the conductive structure is capacitively coupled to the second part of the conductive structure.
An RFID inlay, comprising:
- a first substrate having a first conductive structure disposed thereon;
- a second substrate having a second conductive structure disposed thereon, the second conductive structure having a first portion and at least one second portion wherein the first portion and the second portion of the second conductive structure are coupled by a bridge wherein the first portion of the second conductive structure comprises a radiating element such that the radiating element is a monopole;
- and
- a dielectric layer disposed between the first conductive structure and the first portion of the second conductive structure;
- wherein the at least one second portion of the second conductive structure is capacitively coupled to the first conductive structure.
An RFID inlay, comprising:
- a substrate having a first surface and a second surface;
- a plurality of cuts defined in the substrate so as to partition the substrate into a first area and a second area separable from the first area;
- a plurality of hinges coupled to the first area and the second area;
- a first conductive structure disposed on the first surface of the substrate and coextensive with the first area and at least a portion of the second area;
- a second conductive structure disposed on the second surface of the substrate and coextensive with the first area wherein both the first and the second conductive structure have at least two tuning elements wherein a portion of the first conductive structure that is disposed on the first area is capacitively or conductively coupled to the second conductive structure.
Dependencies are inferred from the claim text.