Hybrid integrated component and method for the manufacture thereof

A method for manufacturing hybrid integrated components including an MEMS element, a cap for a micromechanical structure of the MEMS element, and an ASIC element having circuit components that interact with the micromechanical structure of the MEMS element, comprising:

• CMOS-processing an ASIC substrate and providing a CMOS back-end stack;
• mounting an MEMS substrate on the CMOS back-end stack of the ASIC substrate;
• for each component, producing at least one micromechanical structure in the MEMS substrate, the MEMS substrate extending over an entire thickness of the MEMS substrate;
• mounting a cap wafer one of on the MEMS substrate and the ASIC substrate in such a way that a micromechanical structure of a component is situated in each case in a cavity between the cap wafer and the ASIC substrate;
• separating the components only after the mounting of the cap wafer;
• and
• implementing at least one circuit component of a magnetic sensor system in the CMOS back-end stack,
• wherein the at least one circuit component of the magnetic sensor system includes two coil elements arranged one inside the other, the two coil elements having upper sections and lower sections offset from each other, and
• wherein the ASIC element includes at least one remagnetizable layer area as a coil core for the two coil elements, wherein one of the two coil elements is configured as at least one exciter coil for remagnetizing the coil core, and wherein the other of the two coil elements is configured as at least one measuring coil for detecting a change of the magnetic flux thus caused.

A method for manufacturing hybrid integrated components including an MEMS element, a cap for a micromechanical structure of the MEMS element, and an ASIC element having circuit components that interact with the micromechanical structure of the MEMS element, comprising:

• CMOS-processing an ASIC substrate and providing a CMOS back-end stack;
• producing for each component at least one micromechanical structure in a layered structure on a base substrate of an MEMS substrate;
• mounting the MEMS substrate face down on the CMOS back-end stack of the ASIC substrate;
• only after the mounting, separating the components;
• and
• implementing at least one circuit component of a magnetic sensor system in the CMOS back-end stack,
• wherein the at least one circuit component of the magnetic sensor system includes two coil elements arranged one inside the other, the two coil elements having upper sections and lower sections offset from each other, and
• wherein the ASIC element includes at least one remagnetizable layer area as a coil core for the two coil elements, wherein one of the two coil elements is configured as at least one exciter coil for remagnetizing the coil core, and wherein the other of the two coil elements is configured as at least one measuring coil for detecting a change of the magnetic flux thus caused.