Semiconductor memory devices including an air gap and methods of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Hwang Sim, Jinhyun Shin, Jong-Min Lee
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AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Hwang Sim, Jinhyun Shin, Jong-Min Lee
Estimating the term…
Provided are a semiconductor memory device and a method of fabricating the same, the semiconductor memory device may include a semiconductor substrate with a first trench defining active regions in a first region and a second trench provided in a second region around the first region, a gate electrode provided on the first region to cross the active regions, a charge storing pattern disposed between the gate electrode and the active regions, a blocking insulating layer provided between the gate electrode and the charge storing pattern and extending over the first trench to define a first air gap in the first trench, and an insulating pattern provided spaced apart from a bottom surface of the second trench to define a second air gap in the second trench.
A semiconductor memory device, comprising:
A semiconductor memory device, comprising:
Dependencies are inferred from the claim text.