Methods for cleaving a bonded wafer structure

A method of cleaving a bonded wafer structure comprising a first wafer and a second wafer, the first wafer having a peripheral edge including a first portion, the second wafer having a peripheral edge including a second portion, the first portion disposed opposite the second portion, the method comprising:

• contacting the first portion of the peripheral edge of the first wafer with a surface of an annular member of a first grasping member;
• contacting the second portion of the peripheral edge of the second wafer with a surface of an annular member of a second grasping member, wherein the annular member of the first grasping member or the annular member of the second grasping member has an actuated edge;
• actuating the actuated edge to grasp and release the first wafer or the second wafer;
• and
• cleaving the bonded wafer structure by at least one of (1) applying a force on the first wafer by actuating the first grasping member or (2) applying a force on the second wafer by actuating the second grasping member.