Systems and methods for monitoring and controlling particle sizes in slurries
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsI-Chen Chiang, Yung-Long Chen, Chih-Chiang Tseng, Chi-Chan Yin
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Abstract
Systems and methods are provided for preparing a plurality of slurry particles. The system includes: a tank configured to contain and provide the slurry particles, a sampling module configured to sample at least one slurry particle within the tank and obtain at least one parameter related to a particle size, and a controller coupled to the tank and the sampling module, configured to vibrate the slurry particles within the tank based on the at least one parameter.
Claims19
A system for preparing a plurality of slurry particles, the system comprising:
- a source tank configured to store and provide a stock slurry containing the slurry particles;
- a mixing tank coupled downstream of the source tank;
- a sampling module coupled between the source tank and the mixing tank configured to sample the slurry particles and obtain at least one particle size parameter associated with the slurry particles;
- an ultrasonic vibrator arranged in a circulation path to the source tank;
- and
- a controller coupled to the ultrasonic vibrator and the sampling module, controlling the ultrasonic vibrator to vibrate the slurry particles based on the at least one particle size parameter.
A method for preparing a plurality of slurry particles, the method comprising:
- sampling a slurry containing slurry particles;
- obtaining at least one parameter including a temperature parameter and a particle size parameter associated with the sampled slurry;
- selectively vibrating the slurry to reduce particle size and circulating the slurry to reduce temperature thereof in response to the particle size parameter and the temperature parameter, respectively;
- and
- polishing a semiconductor material by a chemical mechanic polishing (CMP) module using the slurry particles.
A non-transitory computer readable storage medium comprising programming instructions for preparing a plurality of slurry particles, the programming instructions configured to cause one or more data processors to execute operations comprising:
- sampling a slurry containing slurry particles;
- obtaining a temperature parameter and a particle size parameter associated with the sampled slurry;
- selectively vibrating the slurry to reduce particle size and circulating the slurry to reduce temperature thereof in response to the particle size parameter and the temperature parameter, respectively;
- and
- polish a semiconductor material by a chemical mechanic polishing (CMP) module using the slurry particles.
Dependencies are inferred from the claim text.