Wafer-level light emitting diode package and method of fabricating the same

A light emitting diode (LED) package, comprising:

• a plurality of light emitting cells each comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer;
• a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer of each of the light emitting cells, the contact holes exposing the first conductive type semiconductor layer of each of the light emitting cells;
• a protective insulation layer covering a sidewall of each of the light emitting cells;
• a connector located arranged on a first side of the light emitting cells and electrically connecting two adjacent light emitting cells to each other;
• a first bump arranged on the first side of the light emitting cells and electrically connected to the first conductive type semiconductor layer via the plurality of contact holes of a first light emitting cell of the light emitting cells;
• and
• a second bump arranged on the first side of the light emitting cells and electrically connected to the second conductive type semiconductor layer of a second light emitting cell of the light emitting cells.