Antimicrobial composition
AssigneeConvatec Technologies Inc.
InventorsSteven L. Percival, Phillip G. Bowler, David Parsons
Life of this patent
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Abstract
An antiseptic composition suitable for use on skin and wounds comprising a source of an antimicrobial agent and an agent which disrupts biofilms. More, particularly the invention relates to a composition capable of providing effective antimicrobial activity while at the same time avoiding wound and skin irritation and retardation of wound healing.
Claims6
An antiseptic composition suitable for use on skin and wounds comprising 0.01% to 1.0% by weight of an antimicrobial agent comprising iodine, buffering agents to maintain the composition at a pH of about 4 to 6, and from 0.5% to 10% by weight of EDTA or its salts as an agent which disrupts biofilms, wherein the amount of iodine present in the composition is at a level of at least 50% less iodine than if EDTA were not present, such that the composition is able to reduce the bacterial bioburden present on the skin or wound to a level manageable by the host within 24 hours.
An antiseptic composition suitable for use on skin and wounds comprising buffering agents to maintain the composition at a pH of about 4 to 6, 0.01% to 1.0% by weight of iodine and from 0.5% to 10% by weight of EDTA or its salts as an agent which disrupts biofilms, wherein the amount of iodine present in the composition is at a level of at least 50% less iodine than if EDTA were not present.
Dependencies are inferred from the claim text.