Compound slot
AssigneeHewlett-Packard Development Company, L.P.
InventorsNing Ge, Bee Ling Peh, Trudy Benjamin, Ken Kiat Ng, Jianhui Gu
Life of this patent
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Abstract
The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.
Claims15
A compound slot, comprising:
- a wafer, wherein the compound slot comprises:
- a trench along a long axis of the compound slot and on a top surfaceof the wafer, wherein the trench passes through an initial portion of a total depth of the wafer and has a constant width across the compound slot;
- and
- a number of openings that pass through a remaining portion of the total depth of the wafer, wherein at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.
A method of forming a compound slot, comprising:
- forming the compound slot in a wafer;
- wherein forming the compound slot comprises:
- forming a trench along a long axis of the compound slot and on a top surface of the wafer, wherein the trench has a constant width across the compound slot and passes through an initial portion of a total depth of the wafer;
- and
- providing structural support for the compound slot by forming a number of openings through a remaining portion of the total depth of the wafer, wherein forming the number of openings includes retaining at least a portion of a bottom of the trench around an entirety of a perimeter of each of the number of openings.
A system comprising a compound slot, comprising:
- a wafer;
- a trench along an entire length of the compound slot located on a top surface of the wafer, wherein the trench has a constant width across the compound slot, and wherein the trench passes through an initial portion of a total depth of the wafer;
- a number of openings through a remaining portion of the total depth of the wafer, wherein at least a retained portion of a bottom of the trench remains around an entirety of a perimeter of each of the number of openings;
- and
- a fluid ejection device coupled to the trench.
Dependencies are inferred from the claim text.