Realization of three-dimensional components for signal interconnections of electromagnetic waves
AssigneeGoogle Inc.
InventorJamal S. Izadian
Life of this patent
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AssigneeGoogle Inc.
InventorJamal S. Izadian
Estimating the term…
Example three-dimensional signal interconnections for electromagnetic waves and methods for fabricating the interconnections are described. An example apparatus may include a first conducting layer including a plurality of through-holes, and a first layer between the first conducting layer and a second conducting layer. The first layer may include a plurality of through-holes, and the second conducting layer may also include a plurality of through-holes. The plurality of through-holes of the first layer may at least partially be aligned with the plurality of through-holes of the first conducting layer and the plurality through-holes of the second conducting layer. The apparatus may further include a second layer between the second conducting layer and a third conducting layer. The second layer may have a first waveguide channel and a second waveguide channel substantially perpendicular to and intersecting with the first waveguide channel.
A method comprising:
An apparatus comprising:
A method comprising:
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