Method for cleaning reaction chamber using pre-cleaning process
AssigneeASM IP Holding B.V.
InventorsTatsuhiro Okabe, Atsuki Fukazawa
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AssigneeASM IP Holding B.V.
InventorsTatsuhiro Okabe, Atsuki Fukazawa
Estimating the term…
A method for cleaning a reaction chamber is conducted after depositing an oxide, nitride, or oxynitride film on a substrate in a reaction chamber having interior surfaces on which oxide, nitride, or oxynitride is accumulated as a result of the deposition, said oxide, nitride, or oxynitride being selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, metal oxide, metal nitride, and metal oxynitride. The method includes: oxidizing or nitriding the oxide, nitride, or oxynitride is accumulated on the interior surfaces of the reaction chamber, by RF-excited plasma of an oxygen- or nitrogen-containing gas in the absence of halide gas as a pre-cleaning step; and cleaning the interior surfaces of the reaction chamber, by RF-excited plasma of a halide cleaning gas.
A method for cleaning a reaction chamber after depositing an oxide or nitride film on a substrate in a reaction chamber having interior surfaces on which oxide or nitride is accumulated as a result of the deposition, said oxide or nitride being selected from the group consisting of carbon-containing metal oxide or carbon-containing metal nitride, said method comprising the steps of:
Dependencies are inferred from the claim text.