Printed matter manufacturing method, printed matter manufacturing device, and printed matter
AssigneeSeiko Epson Corporation
InventorsKeigo Sugai, Seigo Momose
Life of this patent
Estimating the term…
Abstract
The printed matter manufacturing method includes the steps of providing a printed layer in a predetermined pattern on a substrate, and providing an open part penetrating through the substrate and the printed layer in an open part formation region. The printed matter manufacturing method has a step of providing a buffer layer for mitigating a shock imparted to the printed layer when the open part is provided, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region.
Claims10
A printed matter manufacturing method comprising:
- forming a printed layer in a predetermined pattern on a substrate;
- forming an open part penetrating through the substrate and the printed layer in an open part formation region of the printed layer;
- and
- forming a buffer layer for mitigating a shock imparted to the printed layer by formation of the open part, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region,
- the forming of the buffer layer including forming the buffer layer so that the buffer layer contacts a side of the printed layer opposite from a side from which formation of the open part starts, and
- the forming of the buffer layer further including forming side surfaces of the buffer layer to have a tapered shape that gradually decreases in diameter toward a top surface of the buffer layer that contacts the printed layer.
A printed matter manufacturing device for manufacturing a printed matter in which an open part penetrating through a substrate and a printed layer is formed in an open part formation region of the printed layer, the printed matter manufacturing device comprising:
- a film formation device configured and arranged to form the printed layer in a predetermined pattern on the substrate;
- and
- a control device configured to control the film formation device to form a buffer layer for mitigating a shock imparted to the printed layer by formation of the open part, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region,
- the control device being configured to control the film formation device to form the buffer layer so that the buffer layer contacts a side of the printed layer opposite from a side from which formation of the open part starts, and
- the control device being further configured to control the film formation device to form side surfaces of the buffer layer to have a tapered shape that gradually decreases in diameter toward a top surface of the buffer layer that contacts the printed layer.
Dependencies are inferred from the claim text.