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US 9,127,346 B2Granted
Sputtering target material
AssigneeIshifuku Metal Industry Co., Ltd.
InventorsKoichi Hasegawa, Nobuo Ishii
Life of this patent
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Abstract
This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.
Claims2
A sputtering target material for forming a thin film having high reflectance, said material being an Ag base alloy consisting of Ag having a purity of at least 99.95%, 0.07-0.3 mass % of P and 0.40-1.7 mass % of Cu, wherein P and Cu having a purity of at least 99.9%.
Dependencies are inferred from the claim text.